High Power Open-Frame Reed Relays. Featuring Tungsten contacts for high inrush capability and excellent heat dissipation. Available in Vertical and Flat mounting options.
Vertical Installation (No Suffix): Ideal for high-density packing on the PCB where height is not restricted. Flat Installation (-01): Ideal for card cages or applications with strict height restrictions.
Representative product image; exact package and marking vary by model.Dimension envelope illustration; use the final drawing before PCB/tooling release.
Selection checklist
Breakdown / isolation voltage margin
Switching voltage, carry current and contact rating
Contact form and channel count
Coil voltage and suppression option
PCB/lead spacing, shield pin and creepage distance
Application: hipot, cable test, medical HV, insulation monitoring