Application challenge
- A fully loaded ICT system may contain thousands of switching points; even a small component defect rate affects system yield.
- The test fixture must switch continuity, shorts, analog measurements and sometimes high-voltage stress tests.
- Relay footprint and channel density directly affect PCB cost and scanner size.
Design approach
- Use compact SIP, MSIP, VSIP or VN packages for dense low-voltage measurement matrices.
- Reserve HVR or other high-voltage reed relays for hipot, isolation or fixture discharge channels.
- Build the matrix with serviceability in mind: relay group labels, replaceable boards and clear channel mapping reduce downtime.
- Specify dynamic relay testing and incoming inspection because ICT equipment magnifies component-level defect rates.
Engineering caution: catalog ratings are component-level references. For high-voltage, medical, EV, PV or ATE systems, verify creepage, clearance, leakage, thermal rise, EMC and lifetime in the finished equipment.
Related MiRelay series
SIP, MSIP, VSIP and VN series address density and high-cycle switching; HVR is used where the ICT system also performs high-voltage insulation checks.
Series mentioned: SIP, MSIP, VSIP, VN, HVR high-voltage relays