MSIP & VSIP Series Miniature SIP Reed Relays
Molded Miniature SIP Reed Relays (series)
The MSIP and VSIP series are SHR’s molded miniature SIP reed relay families. The mineral-filled epoxy housing and tinned FeNi-alloy pins deliver a robust, washable miniature package for space-constrained PCB designs.
Series Specifications
| Breakdown voltage (series) | 230 VDC |
| Max contact rating (series) | 10 W |
| Max switching voltage (series) | 200 V (DC or peak AC) |
| Max switching current (series) | 0.5 A |
| Max carry current (series) | 1.0 A |
| Contact resistance, static (series) | 150 mΩ |
| Insulation resistance (series) | 1 TΩ |
| Isolation voltage, coil/contact (series) | 1.5 KVDC |
| Operate / release time (series) | 0.5 ms / 0.1 ms |
| Housing | Mineral-filled epoxy, molded |
Key Highlights
- Miniature molded SIP package
- 1 TΩ insulation resistance
- 1.5KVDC coil-to-contact isolation
- Fast release time 0.1ms
- Washable, fully sealed
Models in This Series
MSIP-1A05/12/24 (B, S, BS, ATE variants), VSIP-1A05/12 series.
Applications
- Compact PCB switching
- Telecommunications
- Industrial electronics
- Instrumentation
All values above are series-level specifications from the official SHR datasheet (MSIP series datasheet); individual model ratings may differ. Please refer to the series datasheet or submit an RFQ to confirm the exact configuration for your application.