Application challenge
- Robotic systems combine sensors, actuators, analog measurements and sometimes high-frequency or high-voltage subsystems.
- The switching device must handle small signals without adding drift while also surviving vibration and high cycle counts.
- Dense controller boards need multiple package options and predictable contact behavior.
Design approach
- Use reed relays for analog and low-level sensor paths where leakage and contact resistance stability matter.
- Choose package families by board density: DIP/PB for serviceable boards, SIP/MSIP/VSIP for compact matrices, and high-voltage families for isolated diagnostic paths.
- For high-frequency sensing, evaluate insertion loss and isolation at the operating frequency.
- Protect contacts from inductive loads with suppression networks when switching coils, solenoids or motor-related circuits.
Engineering caution: catalog ratings are component-level references. For high-voltage, medical, EV, PV or ATE systems, verify creepage, clearance, leakage, thermal rise, EMC and lifetime in the finished equipment.
Related MiRelay series
DIP, PB, MSIP, SIP, HVMR and HVFR families cover different robotics design points from compact signal switching to high-voltage isolation.
Series mentioned: DIP, PB, MSIP, SIP, HVMR, HVFR